HSCT-P heat shrinkable soldering tin terminal with shielded wire
Product Overview:
Used in the shield ground terminal processing, high performance pipe materials, embedded type pinout, during construction for easy installation.
- Product Features
- Specifications
- Technical data
- Video
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Product features:
Flex-shrink ratio 2:1
External friction resistance, good corrosion resistance performance
In line with RoHS -
Part number Heat shrink tuber (mm) Solder ring(mm) Shielding wire(mm) I.D. L I.d. H O.D. L2 HSCP 1.7 1.7±0.1 26±0.5 1.7±0.1 2.0±0.1 1.0 100 HSCP 1.95 1.95±0.1 26±0.5 1.95±0.1 2.0±0.1 1.0 100 HSCP 2.7 2.7±0.2 42±0.5 2.7±0.2 2.5±0.1 1.0 100 HSCP 4.5 4.5±0.2 42±0.5 4.5±0.2 2.5±0.1 1.5 150 HSCP 6.0 6.0±0.2 42±0.5 6.0±0.2 3.5±0.1 1.5 150 HSCP 7.0 7.0±0.5 42±0.5 7.0±0.5 3.5±0.1 1.5 150 HSCP 8.7 8.7±0.5 42±0.5 8.7±0.5 3.5±0.1 1.5 150 HSCP 9.7 9.7±0.5 42±0.5 9.7±0.5 3.5±0.1 1.5 150 HSCP 10.7 10.7±0.5 42±0.5 10.7±0.5 3.5±0.1 1.5 150 HSCP 13.0 13.0±0.0.5 42±0.5 13±0.0.5 4.5±0.1 1.5 150 Color: transparent
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Operation indicator:
Shrink temperature:80℃
Working temperature:-55℃~125℃
Solder starts melting temperature:138℃
Solder all melting temperature:160℃
Conformance to standard:Approvals
Compliance with environmental