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HSCT-P heat shrinkable soldering tin terminal with shielded wire


Product Overview:

Used in the shield ground terminal processing, high performance pipe materials, embedded type pinout, during construction for easy installation.
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  • Product Features
  • Specifications
  • Technical data
  • Video

  • Product features:
    Flex-shrink ratio 2:1 
    External friction resistance, good corrosion resistance performance
    In line with RoHS

  • Part number Heat shrink tuber (mm) Solder ring(mm) Shielding wire(mm)
    I.D. L I.d. H O.D. L2
    HSCP 1.7 1.7±0.1 26±0.5 1.7±0.1 2.0±0.1 1.0 100
     HSCP 1.95 1.95±0.1 26±0.5 1.95±0.1 2.0±0.1 1.0 100
    HSCP 2.7 2.7±0.2 42±0.5 2.7±0.2 2.5±0.1 1.0 100
    HSCP 4.5 4.5±0.2 42±0.5 4.5±0.2 2.5±0.1 1.5 150
    HSCP 6.0 6.0±0.2 42±0.5 6.0±0.2 3.5±0.1 1.5 150
    HSCP 7.0 7.0±0.5 42±0.5 7.0±0.5 3.5±0.1 1.5 150
    HSCP 8.7 8.7±0.5 42±0.5 8.7±0.5 3.5±0.1 1.5 150
    HSCP 9.7 9.7±0.5 42±0.5 9.7±0.5 3.5±0.1 1.5 150
     HSCP 10.7 10.7±0.5 42±0.5 10.7±0.5 3.5±0.1 1.5 150
     HSCP 13.0 13.0±0.0.5 42±0.5 13±0.0.5 4.5±0.1 1.5 150

    Color: transparent

  • Operation indicator:
    Shrink temperature:80℃
    Working temperature:-55℃~125℃
    Solder starts melting temperature:138℃
    Solder all melting temperature:160℃
    Conformance to standard:Approvals
    Compliance with environmental